ELECTRONICS APPLICATIONS
IC CHIP
- Material : Multilayered, copper
- Application : Individual traceability
- Code type : DM 16×16
- Dimension : 1 mm
- Features :
- Marking depth < 100nm
- FULL-STAMP NIR
- <10 ns (one pulse)
MICRO Li-ion Batteries
- Material : Molding compound
- Application : Full traceablity
- Code type : DM 12×12
- Dimension : 1 mm
- Features :
- FULL-STAMP NIR
- <10 ns (one pulse)
IC MOLDED COMPUND
- Material : Molded compund
- Application : Individual traceability
- Code type : DM 14×14
- Dimension : 1 mm
- Features :
- FULL-STAMP NIR
- <10 ns (one pulse)
FlexPC
- Material : Polyamide
- Application : Individual traceability
- Code type : DM 16×16
- Dimension : 1 mm
- Features :
- FULL-STAMP NIR
- <10 ns (one pulse)
WAFER
- Material : Silicon
- Application : Individual traceability
- Code type : DM 12×12
- Dimension : 1.2 mm
- Features :
- FULL-STAMP special
- USP laser NIR
- <1ps (one pulse)
Power electronics package
- Material : Zirconia ceramics
- Application : Individual traceability
- Code type : DM 14×14
- Dimension : 1 mm
- Features :
- PIXEL-STAMP / Glass
- <100ms
